Silicon Clocks Announces MEMS Temperature Stability Breakthrough
Silicon Clocks announced its breakthrough CMEMS-ZeroThermal™ passive temperature compensation technology that enables MEMS resonators to exhibit comparable temperature stability to quartz crystals, while simplifying oscillator design and reducing power and circuit size.
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3-D Camera Tech Reduces Mobile Phone Design Footprint
OmniVision Technologies’ CameraCube™ technology combines the functionality of a single-chip image sensor, embedded image processor and wafer-level optics into a single 2.5 × 2.9 × 2.5 mm package for mobile phones.
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SEOUL, South Korea -- (BUSINESS WIRE) -- Samsung Electronics Co., Ltd. today introduced its latest wireless universal serial bus (USB) solution, developed using Ultra Wide Band (UWB) technology.
Microsemi Corporation’s Power and Microelectronics Group now offers a high-density Single Level Cell (SLC) NAND solid state storage solution in a single integrated plastic ball grid array (PBGA) package.
The HFS-2500 from EM Research operates over 2000 to 2500 MHz for advanced Electronic Warfare applications.
