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Semis / Ics / Mmics > Semis / ICs / MMICs >Semiconductors, SoC
 
Wireless USB Chipset Supports High-Speed, Low-Power Data Transmission between Mobile and Tethered CE Devices
Samsung Electronics Co., Ltd., September-10
Analog Audio Subsystem with Integrated Noise Reduction
National Semiconductor Corporation, August-10
Video SoCs will Enable Mid-range Internet-ready Full-High-Definition 120Hz TVs
STMicroelectronics, August-10
Energy-Efficient Processor Family Targets 1W Video-Enabled Consumer Devices
Applied Micro Circuits Corp., June-10
FPGAs Break Through the Bandwidth Barrier While Lowering System Power and Cost
Altera Corporation, June-10
Single-SoC Solutions for Compact BTS and RRH Applications
DesignArt Networks, June-10
Wireless Communications and Control System on Chip for Industrial Automation Applications
Rabbit, A Digi International Brand, April-10
Programmable System-on-Chip Integrates Higher Performance ADC
Cypress Semiconductor Corp., December-09
Designing a Wireless Heart Rate Monitor with Remote Data Logging
Cypress Semiconductor Corp., October-09
Hybrid Camera Platform Puts Photos, Video on a Chip
Ambarella Inc., February-09
PA Duplexers Simplify Multi-Band CMA Phone Designs
TriQuint Semiconductor, Inc., February-09
Single-chip Reference Designs Available for any Base or Relay Station Form Factor
DesignArt Networks, November-08
Single-chip Reference Designs Available for any Base or Relay Station Form Factor
DesignArt Networks, November-08
SoC Combines Wi-Fi, Active RTLS, and Wireless Sensing
G2 Microsystems, November-08
SoC Provides One Solution Across Multiple Base Station Platforms
Fujitsu Microelectronics America, Inc., November-08
SoC Provides One Solution Across Multiple Base Station Platforms
Fujitsu Microelectronics America, Inc., November-08
WiMAX Femtocell SoC is Fully Integrated
DesignArt Networks, November-08
Broadband Wireless Chipset Provides Seamless Migration
Wavesat, Inc., June-08
Broadband Wireless Chipset Provides Seamless Migration
Wavesat, Inc., June-08
Moving to System on Chip (SoC) Integration
Innovision Research & Technology plc, April-08
Terminal-on-a-Chip for 3G, LTE and WiMAX Deployments
Provigent Inc., December-07
Combo FPGA/DSP Moves into Multi-Protocol Design
Altera Corporation, March-07
Cost Reduction Methodology for FPGA Families
Lattice Semiconductor Corp., March-07
Ultra-Thin Cell Phones
Samsung Electro Mechanics, January-07
Digital Predistortion Product
PMC-Sierra Inc., October-06
WiMAX System-on-Chip
Fujitsu Microelectronics America, Inc., August-06


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Latest Releases

13, 28 & 45 Gb/s High Speed Logic Products in SMT Hittite Microwave Corporation has expanded its High Speed Logic product line with the release of four new logic devices including a 28 Gbps 1:2 Fanout Buffer, a 13 Gbps 1:4 Fanout Buffer, and two XOR/XNOR gates operating at 28 Gbps and 45 Gbps.  


Samsung Handset features ANADIGICS’ PA for Mobile WiMAX Service Continuing to lead the industry in providing mobile device manufacturers with the most efficient and reliable parts for the rapidly expanding 3G and 4G smartphone markets, ANADIGICS, Inc.  












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